Global/local Analyses of Multichip Modules: Automated 3-D Model Construction and Adaptive Finite Element Analysis

Cite Details

M. S. Shephard, T.-L. Sham, L.-Y. Song, V. S. Wong, R. Garimella and et. al., "Global/local Analyses of Multichip Modules: Automated 3-D Model Construction and Adaptive Finite Element Analysis", in Advances in Electronic Packaging 1993 pp. 39-49, Sep 1993

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Abstract

This paper overviews a set of software procedures for the efficient global and local thermal and thermomechanical analysis of multichip modules. This paper emphasizes the automatic construction of the numerical analysis models which form a CIF file specification and the use of automated adaptive finite element methods for the local thermomechanical analyses.

BibTeX Entry

@inproceedings{shephard-1993-globallocal,

author = {M. S. Shephard and T.-L. Sham and L.-Y. Song and V. S. Wong and R. Garimella and et. al.},

title = {Global/local Analyses of Multichip Modules: Automated 3-D Model Construction and Adaptive Finite Element Analysis},

year = {1993},

month = Sep,

booktitle = {Advances in Electronic Packaging 1993 },

pages = {39-49}

}